|
Volumn 99, Issue 1, 2010, Pages 151-158
|
Picosecond laser ablation of SiO2layers on silicon substrates
|
Author keywords
[No Author keywords available]
|
Indexed keywords
BAND GAPS;
DIRECT ABSORPTION;
FLUENCES;
INTENSITY RANGE;
LAYER THICKNESS;
MELTING THRESHOLD;
PEAK INTENSITY;
PHOTON ENERGY;
PICOSECOND LASER ABLATION;
REFLECTED LASER;
SHORT-PULSE LASERS;
SILICON SUBSTRATES;
SILICON WAFER SUBSTRATES;
UV WAVELENGTH;
VAPORISATION;
VAPOUR PRESSURES;
ABSORPTION;
LASER ABLATION;
LASER PULSES;
MELTING;
PULSED LASER APPLICATIONS;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON OXIDES;
SUBSTRATES;
SILICON WAFERS;
|
EID: 77953538753
PISSN: 09478396
EISSN: 14320630
Source Type: Journal
DOI: 10.1007/s00339-009-5464-z Document Type: Article |
Times cited : (72)
|
References (21)
|