Environmental concerns and materials issues in manufactured solder joints

IEEE International Symposium on Electronics & the Environment

Volumn , Issue , 1997, Pages 246-251

  Gibson, A W ^a   Choi, S ^a   Bieler, T R ^a   Subramanian, K N ^a  

^a MICHIGAN STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL IMPACT; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; MICROSTRUCTURE; RELIABILITY; SOLDERING ALLOYS;

COMPOSITE SOLDERS; ELECTRONIC COMPONENTS; MATERIAL MODELS;

SOLDERED JOINTS;

EID: 0030645446     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)