CMOS: Compatible wafer bonding for MEMS and wafer-level 3D integration

Microsystem Technologies

Volumn 18, Issue 7-8, 2012, Pages 1065-1075

  Dragoi, Viorel ^a   Pabo, Eric ^b   Burggraf, Jürgen ^a   Mittendorfer, Gerald ^a  

^a EV GROUP   (Austria)

^b EV Group Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS WAFERS; ELECTRONIC COMPONENT; MEMSDEVICES; OPTICAL COMPONENTS; PROCESS STEPS; PROCESS TEMPERATURE; PROCESSING TECHNIQUE; WAFER BONDING PROCESS; WAFER LEVEL; WAFER-LEVEL 3D INTEGRATION;

MANUFACTURE; THREE DIMENSIONAL;

INTEGRATION;

EID: 84864621420     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-012-1439-7     Document Type: Conference Paper

References (16)

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