Metal thermocompression wafer bonding for 3D integration and MEMS applications

ECS Transactions

Volumn 33, Issue 4, 2010, Pages 27-35

  Dragoi, V ^a   Mittendorfer, G ^a   Burggraf, J ^a   Wimplinger, M ^a  

^a EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; BINARY ALLOYS; COPPER ALLOYS; GOLD; SILICON WAFERS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

AMBIENT ATMOSPHERE; MEMS APPLICATIONS; OXIDIZED SURFACES; SURFACE OXIDATIONS; THERMO-COMPRESSION; THERMOCOMPRESSION WAFER; WAFER BONDING PROCESS; WAFER-LEVEL 3D INTEGRATION;

WAFER BONDING;

EID: 79952661828     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3483491     Document Type: Conference Paper

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