Aluminum-germanium eutectic bonding for 3D integration

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Crnogorac, Filip ^a   Birringer, Ryan ^a   Dauskardt, Reinhold ^a   Pease, Fabian ^a  

^a Stanford University   (United States)

Author keywords

3DIC; Al Ge eutectic; Monolithic integration; Wafer bonding

Indexed keywords

3-D INTEGRATION; AL-GE EUTECTIC; BI-LAYER FILMS; DOUBLE CANTILEVER BEAM; EUTECTIC BONDING; EUTECTIC COMPOSITION; LIQUID PHASE; LOW TEMPERATURES; MONOLITHIC INTEGRATION; MONOLITHICALLY INTEGRATED; SILICON ISLANDS; THREE DIMENSIONAL INTEGRATED CIRCUITS; UPPER LAYER; VOID-FREE;

ALUMINUM; AMORPHOUS SILICON; CANTILEVER BEAMS; EUTECTICS; GERMANIUM; MONOLITHIC INTEGRATED CIRCUITS; SILICON COMPOUNDS; SILICON OXIDES; SILICON WAFERS; THREE DIMENSIONAL;

WAFER BONDING;

EID: 70549094126     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306531     Document Type: Conference Paper

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