Effect of post-annealing conditions on Cu-Cu wafer bonding characteristics

Journal of the Korean Physical Society

Volumn 54, Issue 3, 2009, Pages 1278-1282

  Jang, Eun Jung ^a   Park, Young Bae ^a   Pfeiffer, Sarah ^b   Kim, Bioh ^b   Matthias, Thorsten ^b   Hyun, Seungmin ^c   Lee, Hak Joo ^c  

^a Andong National University   (South Korea)

^b EV Group   (United States)

^c Korea Institute of Machine and Materials   (South Korea)

Author keywords

3 D integration; 4 point bending test; Adhesion; Cu Cu bonding; Post annealing

Indexed keywords

EID: 64549086424     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.54.1278     Document Type: Article

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