Aluminum thermo-compression bonding characterization

Materials Research Society Symposium Proceedings

Volumn 1222, Issue , 2010, Pages 167-172

  Cakmak, E ^a   Dragoi, V ^b   Pabo, E ^a   Matthias, T ^a   Alford, T ^c  

^a EV Group Inc   (United States)

^b EV GROUP   (Austria)

^c ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND INTERFACE; BOND PROCESS; BOND QUALITY; BOND STRENGTH; BONDED WAFERS; BONDING TEMPERATURES; BONDING TIME; FORMING GAS; FOUR-POINT BENDING TEST; INTERFACIAL ADHESION ENERGY; MICRO ELECTRO MECHANICAL SYSTEM; SCANNING ACOUSTIC MICROSCOPY; THERMO COMPRESSION BONDING; THERMO-COMPRESSION; WAFER LEVEL;

ALUMINUM; ATMOSPHERIC TEMPERATURE; COMPOSITE MICROMECHANICS; FLIP CHIP DEVICES; INERT GASES; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; SCANNING ELECTRON MICROSCOPY; SURFACE TREATMENT;

WAFER BONDING;

EID: 77955944970     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. V. Dragoi, G. Mittendorfer, F. Murauer, E. Cakmak and E. Pabo, "Metal Wafer Bonding for MEMS Applications" Mater. Res. Soc. Symp. Proc. Vol. 1139 © 2009 Materials Research Society 1139-GG03-33.
2. C.H. Yun, J.R. Martin, E.B. Tarvin, and J.T. Winbigler, "A1 to A1 wafer bonding for MEMS encapsulation and 3-D Interconnect", IEEE MEMS 2008, Tucson, AZ, USA, January 13-17, 2008.
3. T. Campbell, R. K. Kalia, A. Nakano, and P. Vashishta, "Dynamics of Oxidation of Aluminum Nanoclusters using Variable Charge Molecular-Dynamics, Simulations on Parallel Computers", Physical review letters Volume 82, Number 24.
4. R. Shaviv, S. Toham and P. Woytowitz, Microelectronic. Eng., vol 82, p. 99 (2005).