Wafer bonding process selection

ECS Transactions

Volumn 33, Issue 4, 2010, Pages 509-517

  Dragoi, V ^a   Pabo, E ^b  

^a EV GROUP   (Austria)

^b EV Group Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; PRODUCT DESIGN; SILICON WAFERS;

3-D INTERCONNECTS; ADVANCED PACKAGING; BONDING PROCESS; MEMSDEVICES; WAFER BONDING PROCESS; WAFER LEVEL;

WAFER BONDING;

EID: 79952645871     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3483542     Document Type: Conference Paper

References (10)

1. W. P. Maszara, J. Electrochem. Soc., 138, p. 341 (1991).
2. G. Wallis and D. Pommerantz, J. Appl. Phys., 40, p. 3946 (1969).
3. F. Niklaus, G. Stemme, J.-Q. Lu and R. J. Gutmann, J. of Appl. Phys., 99, p. 031101-1 (2006).
4. J. O'Brien, P. J. Hughes, M. Brunet, B. O'Neill, J. Alderman, B. Lane, A. O'Riordan and C. O'Driscoll, J. of Micromech. Microeng., 11, pp. 353 (2001).
5. R. F. Wolffenbuttel and K. D. Wise, Sensors & Actuators A, 43, p. 223 (1994).
6. W.C. Welch III and K. Najafi, in Proc. of IEEE MEMS 2008, pp. 806, The IEEE Proceedings Series.
7. C. H. Tsau, S. M. Spearing, and M. A. Schmidt, J. of Microelectromech. Systems 13 (6), (2004) pp. 963.
8. MEMS Industry Group (MIG) Best Known Practice Series, http://www.memsindustrygroup.org/
9. V. Dragoi, G. Mittendorfer, C. Thanner and P. Lindner, J. Microsy. Techn., 14, p. 509 (2008).
10. E. Cakmak, V. Dragoi, E. Pabo, T. Matthias and T. Alford, MRS Proceedings vol. 1222, p. 1222-DD04-02 (2009).