Flexible printed circuit boards laser bonding using a laser beam homogenization process

Optics and Lasers in Engineering

Volumn 50, Issue 11, 2012, Pages 1643-1653

  Kim, Joohan ^a   Choi, Haewoon ^b  

^a Seoul National University of Science and Technology   (South Korea)

^b Keimyung University   (South Korea)

Author keywords

Flexible printed circuit boards; FPCB; Laser welding; Micro bonding

Indexed keywords

BEAM HOMOGENIZATION; BONDING PROCESS; BONDING QUALITY; ELECTROMAGNETIC MODELING; FLEXIBLE PRINTED CIRCUIT BOARDS; FPCB; GAUSSIAN LASER BEAM; HEAT TRANSFER SIMULATION; LASER BEAM SHAPING; LASER BONDING; LASER POWER DENSITY; LOCAL HEAT SOURCE; MICRO-BONDING; MICRO-LENS ARRAYS; OPTIMAL BONDING; PROCESS CHARACTERISTICS; RIGID PRINTED CIRCUIT BOARDS; SHEAR STRENGTH TESTS; TEMPERATURE RAMP; YTTERBIUM FIBER LASER;

FIBER LASERS; HOMOGENIZATION METHOD; LASER BEAM WELDING; LASER BEAMS; MICROLENSES; PRINTED CIRCUIT BOARDS; YTTERBIUM;

BONDING;

EID: 84864282986     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlaseng.2012.05.005     Document Type: Article

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