Diode laser soldering using a lead-free filler material for electronic packaging structures

Applied Surface Science

Volumn 252, Issue 13 SPEC. ISS., 2006, Pages 4406-4410

  Chaminade, C ^a   Fogarassy, E ^a   Boisselier, D ^a  

^a Pole API   (France)

Author keywords

Electronic packaging; Laser; Lead free; Soldering; Thermal modelling

Indexed keywords

EXTRACTION; HIGH POWER LASERS; LEAD; SEMICONDUCTOR LASERS; SOLDERING; TIN;

ELECTRONIC PACKAGING; HIGH POWER DIODE LASER (HPDL); LEAD-FREE; THERMAL MODELLING;

ELECTRONICS PACKAGING;

EID: 33646544402     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2005.07.095     Document Type: Article

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