Practical design, simulation, and prototype of a hot bar blade for printed circuit board soldering

Journal of Manufacturing Systems

Volumn 20, Issue 3, 2001, Pages 177-187

  Zhou, Jack ^a   Zhuang, Li ^a   He, Zongyan ^a   Herscovici, Daniel ^b  

^a Drexel University   (United States)

^b Motorola Cellular Subscriber Sector   (United States)

Author keywords

Computer Simulation; Finite Element Analysis; Hot Bar Blade; Soldering Process

Indexed keywords

EID: 0042406486     PISSN: 02786125     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0278-6125(01)80039-X     Document Type: Article

References (12)

1. T. Wojcik, "Hot Bar Process Implementation at WTPC," Lucent Technologies (July 11, 1997).
2. B. Irving, "Brazing and Soldering: Facing New Challenges," Welding Journal (v77, n10, 1998), pp33-37.
3. J.P. Langan, "Solderability Requirements for High-density PWBs," Plating and Surface Finishing (v81, 1994), pp34-38.
4. J.R. Davis, K. Ferjutz, and N.D. Wheaton, ASM Handbook, Vol. 6: Welding, Brazing, and Soldering, 10th ed. (ASM Int'l, 1994).
5. P.L. Geiringer, Handbook of Heat Transfer Media (New York: Reinhold, 1962).
6. H.V Mahaney, "Thermal Modeling of the Infrared Reflow Process for Solder Ball Connect (SBC)," IBM Journal of Research and Development (v37, 1993), pp609-619.
7. F.P. Incropera and D.P. DeWitt, Fundamentals of Heat and Mass Transfer (New York: John Wiley & Sons, 1990).
8. V.S. Arpaci, Conduction Heat Transfer (Reading, MA: Addison-Wesley, 1966).
9. A. Bejan, Convection Heat Transfer (New York: John Wiley & Sons, 1984).
10. R.H. Gallagher, Finite Element Analysis: Fundamentals (Englewood Cliffs, NJ: Prentice-Hall, 1975).
11. ANSYS Workbook, 2nd ed. (SAS IP, Inc., 1995).
12. R.W. Toogood, "ANSYS: Working with Pro Engineer" (Univ. of Alberta, 1998).