On the integration of flexible circuit boards with hot embossed thermoplastic structures for actuator purposes

Sensors and Actuators, A: Physical

Volumn 125, Issue 2, 2006, Pages 534-547

  Svedberg, Malin ^a   Nikolajeff, Fredrik ^a,b   Thornell, Greger ^a,c  

^a UPPSALA UNIVERSITY   (Sweden)

^b Åmic AB ^*  (Sweden)

^c UPPSALA UNIVERSITY   (Sweden)

Author keywords

Actuator; Flexible printed circuit board; Gluing; Hot embossing; Paraffin; Polycarbonate; Polyimide; Thermal bonding

Indexed keywords

FLEXIBLE PRINTED BOARD; HOT EMBOSSING; THERMAL BONDING;

ADHESION; BOND STRENGTH (MATERIALS); CURING; GLUING; MICROACTUATORS; PARAFFINS; POLYCARBONATES; THERMOPLASTICS;

PRINTED CIRCUIT BOARDS;

EID: 29244431646     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.08.015     Document Type: Article

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