Prototyping of a reliable 3D flexible IC cube package by laser micromachining

Microelectronics Reliability

Volumn 49, Issue 7, 2009, Pages 800-805

  Berényi, Richárd ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

3-D PACKAGES; 3D STRUCTURE; APPLICATION OF LASER; AREA REDUCTION; CHIP COOLING; CONTACT PADS; FABRICATION PROCESS; FLEXIBLE CIRCUIT; FLEXIBLE SUBSTRATE; IC CHIPS; LASER MICRO-MACHINING; MATERIAL REMOVING; MECHANICAL INTEGRITY; NARROW LINES; PRINTED WIRING; PROTOTYPING; STACKED PACKAGE; THREE-DIMENSIONAL (3D); UNIQUE FEATURES; UV LASERS;

COMPOSITE MICROMECHANICS; LASER WINDOWS; LASERS; MICROMACHINING; POLYIMIDES; SUBSTRATES; WINDOWS;

THREE DIMENSIONAL;

EID: 67649451982     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.03.015     Document Type: Article

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