Some issues for microsystem packaging in plastic and 3D

Microelectronics Journal

Volumn 29, Issue 9, 1998, Pages 645-650

  Morrissey, A ^a   Kelly, G ^a   Alderman, J ^a   Barrett, J ^a   Lyden, C ^a   O'Rourke, L ^b  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b EUROPEAN SPACE AGENCY   (Netherlands)

Author keywords

3D; Microsystem packaging; Plastic; Residual stress

Indexed keywords

MICROELECTRONIC PROCESSING; PLASTICS; POLYCHLORINATED BIPHENYLS; RESIDUAL STRESSES; THREE DIMENSIONAL;

HERMETICITY; MICROSYSTEM PACKAGING; SILICON MEMBRANE PUMP; THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0032163478     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2692(98)00029-9     Document Type: Article

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