A surface-mounted device assembly technique for small optics based on laser reflow soldering

Optics and Lasers in Engineering

Volumn 43, Issue 3-5, 2005, Pages 365-372

  Stauffer, L ^a   Wursch A ^a,b   Gachter B ^a   Siercks, K ^a   Verettas, I ^a   Rossopoulos, S ^a   Clavel, R ^a  

^a EPFL   (Switzerland)

^b Inopaq   (Switzerland)

Author keywords

Active alignment; Micro optics; Optoelectronic; Packaging; Reflow soldering; SMD

Indexed keywords

ACTIVE ALIGNMENT; LASER REFLOW; REFLOW SOLDERING; SOLDERING TECHNIQUES;

LASER APPLICATIONS; LASER BEAM WELDING; MICROOPTICS; OPTOELECTRONIC DEVICES; PARAMETER ESTIMATION; STIFFNESS; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL;

OPTICAL SYSTEMS;

EID: 9344264079     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlaseng.2004.03.009     Document Type: Article

References (4)

1. Mickelson AR, Basavanhally NC, Lee YC. Optoelectronic packaging. Wiley; New York: 1997.
2. Scussat M, Würsch A. An innovative flexible and accurate packaging technique suited to fabricate low cost micro optoelectronic modules. 50th ECTC Conference, Las Vegas, USA, Mai 2000.
3. Würsch A, Scussat M. An innovative micro optical elements assembly robot characterized by high accuracy and flexibility. 50th ECTC Conference, Las Vegas, USA, Mai 2000.
4. see TRIMO web site www.leica-geosystems.com/trimo-smd.