Experimental and computational study of the morphological evolution of intermetallic compound (Cu 6Sn 5) layers at the Cu/Sn interface under isothermal soldering conditions

Acta Materialia

Volumn 60, Issue 13-14, 2012, Pages 5125-5134

  Park, M S ^a   Stephenson, M K ^a   Shannon, C ^a   Caceres Diaz L A ^c   Hudspeth, K A ^a   Gibbons, S L ^a   Munoz Saldana J ^c   Arroyave R ^a,b  

^a Department of Electrical and Computer Engineering   (United States)

^b TEXAS A AND M UNIVERSITY   (United States)

^c DEPARTAMENTO DE FÍSICA   (Mexico)

Author keywords

Dipping method; Growth of Cu 6Sn 5 layer; Morphology; Phase field model; Roughness

Indexed keywords

COMPUTATIONAL STUDIES; DIPPING METHOD; GRAIN COARSENING; IMC LAYER; INTERFACE FORMATION; INTERFACE ROUGHNESS; MODEL PARAMETERS; MORPHOLOGICAL EVOLUTION; MORPHOLOGY EVOLUTION; PARAMETER SET; PARAMETRIC INVESTIGATIONS; PHASE-FIELD MODELS; PHASE-FIELD SIMULATION; QUANTITATIVE AGREEMENT; SOLDERING REACTIONS; TIME EVOLUTIONS; TRANSPORT MECHANISM;

COMPUTER SIMULATION; EXPERIMENTS; GRAIN BOUNDARIES; INTERMETALLICS; LEAD; LEAD COMPOUNDS; MICROSTRUCTURAL EVOLUTION; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLDERING ALLOYS; SURFACE ROUGHNESS;

TIN;

EID: 84864068709     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2012.06.008     Document Type: Article

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