Asymmetrical growth of Cu 6Sn 5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

Intermetallics

Volumn 29, Issue , 2012, Pages 155-158

  Guo, Ming Yung ^a   Lin, C K ^a   Chen, Chih ^a   Tu, K N ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

A. Intermetallics, miscellaneous; B. Diffusion; B. Thermal properties; C. Joining

Indexed keywords

HEAT OF TRANSPORT; HOT PLATES; INTERMETALLICS , MISCELLANEOUS; LIQUID SOLDERS; SN-AG SOLDER; SOLDER JOINTS; THERMOMIGRATION;

INTERMETALLICS; SOLDERING ALLOYS;

TIN;

EID: 84863986022     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2012.06.003     Document Type: Article

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