Thermal performance of microchannels with wavy walls for electronics cooling

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Gong, Liang ^a   Kota, Krishna ^b   Tao, Wenquan ^a   Joshi, Yogendra ^b  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

PIV; Electronics cooling; Heat transfer; Wavy channels

Indexed keywords

ACCEPTABLE LIMIT; ELECTRONICS COOLING; FLUID FLOW; HEAT TRANSFER PERFORMANCE; HYDRAULIC DIAMETER; LAMINAR FLUID FLOW; LOW REYNOLDS NUMBER; MICRO CHANNEL HEAT SINKS; MICRO PIV; STRAIGHT CHANNEL; THERMAL PERFORMANCE; WAVY CHANNELS; WAVY WALL;

COOLING; ELECTRONICS ENGINEERING; HEAT SINKS; LAMINAR FLOW; LEAKAGE (FLUID); REYNOLDS NUMBER;

MICROCHANNELS;

EID: 77955198867     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501323     Document Type: Conference Paper

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