Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips

Journal of Heat Transfer

Volumn 132, Issue 8, 2010, Pages 1-10

  Escher, W ^a,b   Brunschwiler, T ^a   Michel, B ^a   Poulikakos, D ^b  

^a IBM RESEARCH ZURICH   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

Electronics cooling; Heat transfer; Impinging jet; Manifold; Microchannels

Indexed keywords

COOLING EFFICIENCY; COOLING POWER DENSITY; DESIGN PARAMETERS; ELECTRONICS COOLING; EXPERIMENTAL INVESTIGATIONS; FLUID INLET TEMPERATURE; HEAT TRANSFER STRUCTURES; HEATER TEMPERATURES; IMPINGING JET; LIQUID COOLANT; MANIFOLD MICROCHANNEL; MAXIMUM TEMPERATURE; MICRO PROCESSING; PUMPING POWER; STRUCTURED SURFACES; TEMPERATURE RISE; TEST VEHICLE; THERMAL CHARACTERIZATION; THERMAL PERFORMANCE; THERMAL RESISTANCE; THERMAL TEST CHIPS; ULTRA-THIN; VOLUMETRIC FLOW RATE;

AUTOMOBILE ELECTRONIC EQUIPMENT; CHIP SCALE PACKAGES; COMBUSTORS; COOLING; COOLING SYSTEMS; FABRICATION; FLUID DYNAMICS; HEAT SINKS; HYDRODYNAMICS; INLET FLOW; LIQUIDS; STRUCTURAL OPTIMIZATION; TWO DIMENSIONAL;

MICROCHANNELS;

EID: 77955293977     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.4001306     Document Type: Article

References (26)

1. Sauciuc, I., Chrysler, G., Mahajan, R., and Szleper, M., 2003, "Air-Cooling Extension-Performance Limits for Processor Cooling Applications," Proceedings of the 19th IEEE SEMI-THERM Symposium, pp. 74-81.
2. Brunschwiler, T., Smith, B., Ruetsche, E., and Michel, B., 2009, "Toward Zero-Emission Data Centers Through Direct Reuse of Thermal Energy," IBM J. Res. Dev., 53(3), pp. 11:1-11:13.
3. Tuckerman, D. B., and Pease, R. F. W., 1981, "Implications of High-Performance Heat Sinking for Electron Devices," IEEE Trans. Electron Devices, 28(10), pp. 1230-1231.
4. Agostini, B., Fabbri, M., Park, J. E., Wojtan, L., Thome, J. R., and Michel, B., 2007, "State of the Art of High Heat Flux Cooling Technologies," Heat Transfer Eng., 28(4), pp. 258-281.
5. Kandlikar, S. G., 2005, "High Flux Heat Removal With Microchannels-A Roadmap of Challenges and Opportunities," Heat Transfer Eng., 26(8), pp. 5-14.
6. Hassan, I., Phutthavong, P., and Abdelgawad, M., 2004, "Microchannel Heat Sinks: An Overview of the State-of-the-Art," Nanoscale Microscale Thermophys. Eng., 8(3), pp. 183-205.
7. Chen, Y. P., and Cheng, P., 2002, "Heat Transfer and Pressure Drop in Fractal Tree-Like Microchannel Nets," Int. J. Heat Mass Transfer, 45(13), pp. 2643-2648.
8. Chen, Y. P., and Cheng, P., 2005, "An Experimental Investigation on the Thermal Efficiency of Fractal Tree-Like Microchannel Nets," Int. Commun. Heat Mass Transfer, 32(7), pp. 931-938.
9. Perret, C., Boussey, J., Schaeffer, C., and Coyaud, M., 2000, "Analytic Modeling, Optimization, and Realization of Cooling Devices in Silicon Technology," IEEE Trans. Compon. Packag. Technol., 23(4), pp. 665-672.
10. Senn, S. M., and Poulikakos, D., 2004, "Laminar Mixing, Heat Transfer and Pressure Drop in Tree-Like Microchannel Nets and Their Application for Thermal Management in Polymer Electrolyte Fuel Cells," J. Power Sources, 130(1-2), pp. 178-191.
11. Bejan, A., and Errera, M. R., 2000, "Convective Trees of Fluid Channels for Volumetric Cooling," Int. J. Heat Mass Transfer, 43(17), pp. 3105-3118.
12. Calame, J. P., Park, D., Bass, R., Myers, R. E., and Safier, P. N., 2009, "Investigation of Hierarchically Branched-Microchannel Coolers Fabricated by Deep Reactive Ion Etching for Electronics Cooling Applications," ASME J. Heat Transfer, 131(5), pp. 051401-051409.
13. Escher, W., Michel, B., and Poulikakos, D., 2009, "Efficiency of Optimized Bifurcating Tree-Like and Parallel Microchannel Networks in the Cooling of Electronics," Int. J. Heat Mass Transfer, 52(5-6), pp. 1421-1430.
14. Harpole, G. M., and Eninger, J. E., 1991, "Micro-Channel Heat Exchanger Optimization," Proceedings of the Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium, Phoenix, AZ, pp. 59-63.
15. Copeland, D., 1995, "Manifold Microchannel Heat Sinks: Analysis and Optimization," Therm. Sci. Eng., 3(1), pp. 7-12.
16. Copeland, D., Takahira, H., Nakayama, W., and Pak, B. C., 1995, "Manifold Microchannel Heat Sinks: Theory and Experiment," Proceedings of the. International Electronic Packaging Conference (INTERPACK '95), Lahaina, HI, T. R. Hsu, A. Bar-Cohen, and W. Nakayama, eds., Vol. 2, pp. 829-835.
17. Copeland, D., Behnia, M., and Nakayama, W., 1996, "Manifold Microchannel Heat Sinks: Isothermal Analysis," Proceedungs of the Fifth InterSociety Conference on Thermal Phenomena in Electronic Systems (I-THERM V), Orlando, FL, pp. 96-102.
18. Copeland, D., Behnia, M., and Nakayama, W., 1998, "Manifold Microchannel Heat Sinks: Conjugate and Extended Models," International Journal of Microelectronic Packaging, Materials and Technologies, 1(2), pp. 139-152.
19. Ryu, J. H., Choi, D. H., and Kim, S. J., 2003, "Three-Dimensional Numerical Optimization of a Manifold Microchannel Heat Sink," Int. J. Heat Mass Transfer, 46(9), pp. 1553-1562.
20. Kermani, E., Dessiatoun, S., Shooshtari, A., and Ohadi, M. M., 2009, "Experimental Investigation of Heat Transfer Performance of a Manifold Microchannel Heat Sink for Cooling of Concentrated Solar Cells," 2009 IEEE 59th Electronic Components and Technology Conference, San Diego, CA.
21. Colgan, E. G., Furman, B., Gaynes, M., Labianca, N., Magerlein, J. H., Polas-tre, R., Bezama, R., Marston, K., and Schmidt, R., 2006, "High Performance and Subambient Silicon Microchannel Cooling," Proceedings of the Fourth International Conference on Nanochannels, Microchannels, and Minichannels, Limerick, Ireland, pp. 1046-1051.
22. Brunschwiler, T., Rothuizen, H., Fabbri, M., Kloter, U., and Michel, B., 2006, "Direct Liquid Jet Impingement Cooling With Micronsized Nozzle Array and Distributed Return Architecture," 2006 Proceedings 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, San Diego, CA.
23. Escher, W., Michel, B., and Poulikakos, D., 2010, "A Novel High Performance, Ultra Thin Heat Sink for Electronics," Int. J. Heat Fluid Flow to be published. 10.1016/j.ijheatfluidflow.2010.03.001
24. Muzychka, Y S., and Yovanovich, M. M., 2004, "Laminar Forced Convection Heat Transfer in the Combined Entry Region of Non-Circular Ducts," ASME J. Heat Transfer, 126(1), pp. 54-61.
25. Steinke, M. E., and Kandlikar, S. G., 2006, "Single-Phase Liquid Heat Transfer in Plain and Enhanced Microchannels," Proceedings of the Fourth ASME International Conference on Nanochannels, Microchannels, and Minichannels, Limerick, Ireland, pp. 943-951.
26. Brunschwiler, T., Michel, B., Rothuizen, H., Kloter, U., Wunderle, B., Oppermann, H., and Reichl, H., 2008, "Forced Convective Interlayer Cooling in Vertically Integrated Packages," Proceedings of the 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, pp. 1114-1125.