Temperature Distribution in Polishing Pad during CMP Process: Effect of Retaining Ring

International Journal of Precision Engineering and Manufacturing

Volumn 13, Issue 1, 2012, Pages 25-31

  Lee, Hyunseop ^a   Guo, Yongchang ^b   Jeong, Haedo ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Pusan National University   (South Korea)

Author keywords

Chemical mechanical planarization (CMP); Friction; Kinematical analysis; Retaining ring; Temperature distribution

Indexed keywords

ABRASIVES; CHEMICAL ANALYSIS; CHEMICAL MECHANICAL POLISHING; FORECASTING; FRICTION; INDICATORS (CHEMICAL); POLISHING;

CHEMICAL REMOVALS; CHEMICAL-MECHANICAL PLANARIZATION PROCESS; DISTRIBUTION OF TEMPERATURE RISE; FRICTIONAL CHARACTERISTICS; KINEMATICAL ANALYSIS; MEMBRANE TYPES; POLISHING PADS; RETAINING RING;

TEMPERATURE DISTRIBUTION;

EID: 84863135386     PISSN: 22347593     EISSN: 20054602     Source Type: Journal    
DOI: 10.1007/s12541-012-0004-8     Document Type: Article

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