Heat and its effects to chemical mechanical polishing

Journal of Materials Processing Technology

Volumn 178, Issue 1-3, 2006, Pages 82-87

  Kwon, Daehee ^a   Kim, Hyoungjae ^a   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

Author keywords

Chemical mechanical polishing; Heat; Pad; Real contact area; Slurry

Indexed keywords

ABRASION; ELASTIC MODULI; INFRARED DEVICES; PH EFFECTS; SLURRIES; THERMAL EFFECTS;

HEAT; IR DIGITAL CAMERA; PAD SURFACES; REAL CONTACT AREA;

CHEMICAL MECHANICAL POLISHING;

EID: 33746712826     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2005.11.025     Document Type: Article

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