The characteristics of frictional behavior in CMP using an integrated monitoring system

Key Engineering Materials

Volumn 339, Issue , 2007, Pages 152-157

  Lee, H S ^a   Park, B Y ^a   Park, S M ^a   Kim, H J ^a   Jeong, H D ^a  

^a Pusan National University   (South Korea)

Author keywords

CMP; CMP monitoring system; Friction force; Process temperature

Indexed keywords

DATA ACQUISITION; FRICTION; INFRARED RADIATION; SILICA; WSI CIRCUITS;

CHEMICAL FACTORS; GLOBAL PLANARIZATION; INTEGRATED MONITORING SYSTEM; WAFER SURFACES;

CHEMICAL MECHANICAL POLISHING;

EID: 33947233907     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-430-8.152     Document Type: Conference Paper

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