A method for direct measurement of substrate temperature during copper CMP

Journal of the Electrochemical Society

Volumn 152, Issue 7, 2005, Pages

  Sampurno, Yasa A ^a   Borucki, Leonard ^b   Zhuang, Yun ^a   Boning, Duane ^c   Philipossian, Ara ^a  

^a University of Arizona   (United States)

^b Intelligent Planar   (United States)

^c Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; COMPUTER SIMULATION; COPPER; CORRELATION METHODS; INFRARED DEVICES; MATHEMATICAL MODELS; SUBSTRATES; TEMPERATURE DISTRIBUTION;

CHEMICAL MECHANICAL PLANARIZATION (CMP); DIRECT TEMPERATURE MEASUREMENT; SUBSTRATE TEMPERATURE; THERMAL MODEL;

TEMPERATURE MEASUREMENT;

EID: 23744506407     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1925070     Document Type: Article

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