Mechanical characteristics of the hard-polydimethylsiloxane for smart lithography

Springer Proceedings in Physics

Volumn 124, Issue , 2008, Pages 229-237

  Kim, Ki Hwan ^a,b   Song, Na Young ^a   Choo, Byung Kwon ^a   Pribat, Didier ^b   Jang, Jin ^a   Park, Kyu Chang ^a  

^a Kyung Hee University   (South Korea)

^b LABORATOIRE DE PHYSIQUE DES INTERFACES ET DES COUCHES MINCES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; HARDNESS; MECHANICAL PROPERTIES; MICROCHANNELS; NANOTECHNOLOGY; PHOTOLITHOGRAPHY; POLYDIMETHYLSILOXANE;

COMPOSITION RATIO; MECHANICAL CHARACTERISTICS; NANOSCALE PATTERNING; PATTERN COLLAPSE; PATTERNING PROCESS; POLYDIMETHYLSILOXANE PDMS; RADIUS OF CURVATURE; SOFT LITHOGRAPHY;

SILICONES;

EID: 84862828161     PISSN: 09308989     EISSN: 18674941     Source Type: Conference Proceeding    
DOI: 10.1007/978-3-540-85190-5_24     Document Type: Conference Paper

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