Deposition, microstructure and hardness of TiN/(Ti,Al)N multilayer films

International Journal of Refractory Metals and Hard Materials

Volumn 32, Issue , 2012, Pages 27-32

  Zhao, Y H ^a   Hu, L ^b   Lin, G Q ^b   Xiao, J Q ^a   Dong, C ^b   Yu, B H ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

Hardness; Pulse biased arc ion plating; TEM; TiN (Ti,Al)N multilayer films

Indexed keywords

CROSS-SECTIONAL STRUCTURES; DEPOSITION CHAMBERS; HARDNESS VALUES; INTERFACIAL REGION; PULSE BIASED ARC ION PLATING; PULSE BIASED ARC ION PLATINGS; SCRATCH TEST; STAINLESS STEEL SUBSTRATES; SUB-LAYERS; TIAL ALLOY; TIN/(TI ,AL)N; XRD;

ADHESION; ALUMINUM; CRYSTALLOGRAPHY; HARDNESS; MICROSTRUCTURE; MULTILAYER FILMS; NANOINDENTATION; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

TITANIUM ALLOYS;

EID: 84862803138     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2012.01.003     Document Type: Article

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