Board level dynamic response and solder ball joint reliability analysis under drop impact test with various impact orientations

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 1080-1085

  Xu, Z J ^a   Yu, T X ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BARS (METAL); BRAZING; CELLULAR TELEPHONE SYSTEMS; COMPUTER SOFTWARE; DROPS; DYNAMIC RESPONSE; ELASTICITY; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; LEAD; NATURAL FREQUENCIES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SOLDERED JOINTS; SPHERES; STRUCTURAL DESIGN; TELECOMMUNICATION EQUIPMENT; TESTING; WELDING;

BOARD LEVEL DROP TESTS; CELL PHONES; CRITICAL ISSUES; DROP IMPACTS; DROP TESTS; FAILURE MECHANISMS; FINITE-ELEMENT METHODS; LEAD-FREE SOLDERS; PORTABLE ELECTRONICS; RATE-DEPENDENT MATERIALS; SIMULATION RESULTS; SOFTWARE ABAQUS; SOLDER BALL SHEARS; SOLDER BALLS; SOLDER JOINTS; SPLIT HOPKINSON BARS; STRESS/STRAIN;

STRAIN RATE;

EID: 63049086727     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763573     Document Type: Conference Paper

References (10)

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2. Jing-En Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong, and Jiang Zhou. Advanced "Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability during Drop Impact" IEEE Transactions, Volume 29, Issue 3, Sept. 2006, Pages 449 - 456.
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4. th, 2007 Austin, TX, U.S.
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7. th, May 29 -June 1 2007, Pages 528-535.
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