Experimental determination of thermal profiles during laser spike annealing with quantitative comparison to 3-dimensional simulations

Applied Physics Letters

Volumn 100, Issue 21, 2012, Pages

  Iyengar, Krishna ^a   Jung, Byungki ^b   Willemann, Michael ^b   Clancy, Paulette ^b   Thompson, Michael O ^b  

^a Cornell University ^*  (United States)

^b School of Operations Research and Industrial Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-DIMENSIONAL; COMPLEX ENVIRONMENTS; CRITICAL EVALUATION; EXPERIMENTAL DETERMINATION; LASER INTENSITIES; MATERIAL PARAMETER; PLATINUM RESISTORS; QUANTITATIVE COMPARISON; RESISTANCE CHANGE; SPATIAL RESOLUTION; SPECIFIC MATERIALS; SPIKE ANNEALING; TEMPERATURE PROFILES; TEMPORAL RESOLUTION; THERMAL PROFILES; THERMAL VARIATION; THIN GOLD FILM; TIME RESOLUTION; TIME-DEPENDENT TEMPERATURE;

PLATINUM;

TEMPERATURE MEASUREMENT;

EID: 84861796588     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4717745     Document Type: Article

References (19)

1. A. Shima, Y. Wang, D. Upadhyaya, L. Feng, S. Talwar, and A. Hiraiwa, Dig. Tech. Pap.-Symp. VLSI Technol. 2005, 144-145.
2. T. Yamamoto, T. Kubo, T. Sukegawa, A. Katakami, Y. Shimamune, N. Tamura, H. Ohta, T. Miyashita, S. Sato, M. Kase, and T. Sugii, Dig. Tech. Pap.-Symp. VLSI Technol. 2007, 122-123.
3. J. E. Moody and R. H. Hendel, J. Appl. Phys. 53 (6), 4364-4371 (1982). 10.1063/1.331217
4. A. Colin, P. Morin, F. Cacho, H. Bono, R. Beneyton, M. Bidaud, D. Mathiot, and E. Fogarassy, Mater. Sci. Eng., B 154-155, 31-34 (2008). 10.1016/j.mseb.2008.09.009
5. S. Chen, J. Hebb, A. Jain, S. Shetty, and Y. Wang, in 15th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2007 (IEEE, 2007), pp. 239-244.
6. A. Rajagopal, S. Walavalkar, S. Chen, L. Guo, T. Gwinn, and A. Scherer, Appl. Phys. Lett. 97 (13), 133109 (2010). 10.1063/1.3494088
7. K. G. Kreider and G. Gillen, Thin Solid Films 376 (1-2), 3237 (2000). 10.1016/S0040-6090(00)01346-8
8. X. Xu, C. P. Grigoropoulos, and R. E. Russo, Appl. Phys. A: Mater. Sci. Process. 62, 51-59 (1996). 10.1007/BF01568087
9. J. A. Kittl, R. Reitano, M. J. Aziz, D. P. Brunco, and M. O. Thompson, J. Appl. Phys. 73 (8), 3725-3733 (1993). 10.1063/1.352903
10. K. Etessam-Yazdani, M. Asheghi, and H. F. Hamann, Nanoscale Microscale Thermophys. Eng. 13 (4), 203-217 (2009). 10.1080/15567260903276908
11. K. G. Kreider, D. C. Ripple, and W. A. Kimes, Meas. Sci. Technol. 20 (4), 045206 (2009). 10.1088/0957-0233/20/4/045206
12. K. Iyengar, P. Clancy, and M. O. Thompson, Cornell Laser Annealing Simulation Package (CLASP), 2011.
13. K. Iyengar, P. Clancy, and M. O. Thompson, in 18th International Conference on Advanced Thermal Processing of Semiconductors (RTP) (IEEE, 2010), pp. 90-96.
14. K. Iyengar, P. Clancy, and M. O. Thompson, private communication.
15. Properties of Crystalline Silicon, edited by, R. Hull, (INSPEC, The Institution of Electrical Engineers, London, 1999).
16. G. A. Slack, J. Appl. Phys. 35 (12), 3460-3466 (1964). 10.1063/1.1713251
17. T. Sota and K. Suzuki, Phys. Status Solidi B 163 (1), K5-K7 (1991). 10.1002/pssb.2221630133
18. C. J. Glassbrenner and G. A. Slack, Phys. Rev. 134 (4A), A1058-A1069 (1964). 10.1103/PhysRev.134.A1058
19. F. Cacho, H. Bono, R. Beneyton, B. Dumont, A. Colin, and P. Morin, J. Appl. Phys. 108 (1), 014902 (2010). 10.1063/1.3452385