A 3D model for simulating temperature and stress profiles during sub-millisecond laser spike annealing

18th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2010

Volumn , Issue , 2010, Pages 90-96

  Iyengar, Krishna A ^a   Clancy, Paulette ^b   Thompson, Michael ^a  

^a Cornell University ^*  (United States)

^b School of Operations Research and Industrial Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

2-D MODEL; 3D MODELS; BEAM PROFILES; EXPERIMENTAL MEASUREMENTS; FINITE ELEMENT SIMULATORS; LASER BEAM SIZE; LASER INTENSITIES; NARROW BEAMS; OPTICAL AND MECHANICAL PROPERTIES; PEAK TEMPERATURES; RATE DEPENDENT; SLIP SYSTEM; SPATIAL FLUCTUATION; SPATIAL VARIATIONS; SPIKE ANNEALING; STRESS FIELD; STRESS PROFILE; TEMPERATURE PROFILES; TEMPERATURE UNIFORMITY; TEMPERATURE-TIME PROFILES; THERMAL PROFILES; THERMALLY INDUCED STRESS;

LASER BEAM EFFECTS; MECHANICAL PROPERTIES; RAPID THERMAL ANNEALING; SEMICONDUCTOR LASERS; STRESSES;

THREE DIMENSIONAL;

EID: 78650466046     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RTP.2010.5623792     Document Type: Conference Paper

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