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Volumn 271, Issue 1-2, 1999, Pages 458-468

A new model for diffusion bonding and its application to duplex alloys

Author keywords

Bonding time; Creep; Diffusion bonding; Duplex alloys

Indexed keywords


EID: 0000434221     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(99)00315-9     Document Type: Article
Times cited : (85)

References (28)
  • 5
    • 85162602137 scopus 로고
    • Advances in welding science and tech.
    • D.W. Walsh, J.P. Balaguer, Advances in Welding Science and Tech., TWR 86 (1986).
    • (1986) TWR , vol.86
    • Walsh, D.W.1    Balaguer, J.P.2
  • 13
    • 0024029780 scopus 로고
    • G.R. Kamat, Weld. J. 67 (6) (1988) 44-46.
    • (1988) Weld. J. , vol.67 , Issue.6 , pp. 44-46
    • Kamat, G.R.1
  • 21
    • 85162583902 scopus 로고    scopus 로고
    • PhD Thesis, University of Firat
    • N. Orhan, PhD Thesis, University of Firat, 1996.
    • (1996)
    • Orhan, N.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.