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Volumn 271, Issue 1-2, 1999, Pages 458-468
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A new model for diffusion bonding and its application to duplex alloys
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Author keywords
Bonding time; Creep; Diffusion bonding; Duplex alloys
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Indexed keywords
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EID: 0000434221
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/s0921-5093(99)00315-9 Document Type: Article |
Times cited : (85)
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References (28)
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