Low temperature thermocompression bonding between aligned carbon nanotubes and metallized substrate

Nanotechnology

Volumn 22, Issue 34, 2011, Pages

  Chen, M X ^a,b   Song, X H ^b,c   Gan, Z Y ^a,b   Liu, S ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c Henan Academy of Science   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNED CARBON NANOTUBES; BONDING INTERFACES; BONDING STRENGTH; BONDING TEMPERATURES; BONDING TIME; BULK MATERIALS; BULK METALS; HIGH SURFACE ENERGY; HIGH TEMPERATURE; LOW TEMPERATURES; METALLIZED LAYERS; METALLIZED SUBSTRATES; NANO-METAL; THERMAL CONTACT; THERMO COMPRESSION BONDING; VERTICALLY ALIGNED CARBON NANOTUBE;

CARBON NANOTUBES; CHEMICAL VAPOR DEPOSITION; DIFFUSION BONDING; METALLIZING; SUBSTRATES; SURFACE CHEMISTRY;

DEBONDING;

EID: 79961034807     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/22/34/345704     Document Type: Article

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