Current induced grain growth of electroplated copper film

Japanese Journal of Applied Physics

Volumn 51, Issue 5 PART 2, 2012, Pages

  Razak, Liyana ^a   Yamaguchi, Takamasa ^a   Akahori, Seishi ^b   Hashimoto, Hideki ^b   Ueno, Kazuyoshi ^a  

^a SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

^b TORAY RESEARCH CENTER INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVE CONCENTRATIONS; ANISOTROPIC GRAIN GROWTH; CURRENT DIRECTION; CURRENT STRESS; ELECTROPLATED COPPER; ELECTROPLATED COPPER FILM; GRAIN SIZE; HIGH CURRENT DENSITIES; HIGH TEMPERATURE; SULFOPROPYL SULFONATES;

COPPER; POLYETHYLENE GLYCOLS;

GRAIN GROWTH;

EID: 84861503496     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.51.05EA04     Document Type: Conference Paper

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