Enhancement of the ductility of electrodeposited copper films by room-temperature recrystallization

Journal of the Electrochemical Society

Volumn 153, Issue 2, 2006, Pages

  Hasegawa, Madoka ^a   Nonaka, Yuichi ^a   Negishi, Yoshinori ^a   Okinaka, Yutaka ^a   Osaka, Tetsuya ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DUCTILITY; ELECTRIC RESISTANCE; ELECTRODEPOSITION; RECRYSTALLIZATION (METALLURGY); SEMICONDUCTOR DEVICES;

CRYSTALLOGRAPHIC STRUCTURE; ELECTRODEPOSITED COPPER FILMS; POLYETHYLENE GLYCOL; ROOM-TEMPERATURE RECRYSTALLIZATION;

METALLIC FILMS;

EID: 30644472357     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2149299     Document Type: Article

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