Depth-resolved residual stress analysis of thin coatings by a new FIB-DIC method

Materials Science and Engineering: A

Volumn 528, Issue 27, 2011, Pages 7901-7908

  Sebastiani, Marco ^a   Eberl, Christoph ^b,c   Bemporad, Edoardo ^a   Pharr, George M ^d,e  

^a ROMA TRE UNIVERSITY   (Italy)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^c Johns Hopkins University   (United States)

^d University of Tennessee   (United States)

^e OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Digital image correlation (DIC); Focused ion beam (FIB); Hole drilling method; Residual stress; Ring core; Thin films

Indexed keywords

CHROMIUM COMPOUNDS; FINITE ELEMENT METHOD; FOCUSED ION BEAMS; GOLD COATINGS; GRAIN GROWTH; IMAGE CORRELATION; MILLING (MACHINING); STRAIN MEASUREMENT; STRESS ANALYSIS; STRESS RELAXATION; SURFACE STRESS;

DEPTH-RESOLVED; DIGITAL IMAGE CORRELATION; DIGITAL IMAGE CORRELATIONS; FOCUSED ION BEAM; FOCUSED IONS BEAMS; HOLE DRILLING METHOD; RESIDUAL STRESS ANALYSIS; RING-CORE; THIN-FILMS; THINNER COATINGS;

RESIDUAL STRESSES;

EID: 84860421132     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.07.001     Document Type: Article

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