A direct method of determining complex depth profiles of residual stresses in thin films on a nanoscale

Acta Materialia

Volumn 55, Issue 14, 2007, Pages 4835-4844

  Massl, S ^a   Keckes, J ^b   Pippan, R ^a  

^a ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

^b UNIVERSITY OF LEOBEN   (Austria)

Author keywords

Ion beam processing; Nickel; Residual stresses; Thin films

Indexed keywords

ION BEAM PROCESSING; MICROCANTILEVERS; STRESS PROFILES;

AMORPHOUS MATERIALS; CRYSTALLINE MATERIALS; FILM THICKNESS; NICKEL; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; STRESS CONCENTRATION;

THIN FILMS;

EID: 34447304336     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.05.002     Document Type: Article

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