An experimentally validated model for transport in thin, high thermal conductivity, low CTE heat spreaders

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

Volumn 2, Issue , 2011, Pages 69-80

  Ranjan, Ram ^a   Murthy, Jayathi Y ^a   Garimella, Suresh V ^a   Altman, David H ^b  

^a PURDUE UNIVERSITY   (United States)

^b RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY LIMITS; EXPERIMENTAL MEASUREMENTS; HEAT SOURCES; HEAT SPREADERS; HIGH HEAT FLUX; HIGH THERMAL CONDUCTIVITY; INPUT PARAMETER; LOW CTE; MODEL PREDICTION; PHASE CHANGES; SMALL SCALE; THERMAL PERFORMANCE; THERMAL SPREADERS; ULTRA-THIN; VAPOR CHAMBER; WICK STRUCTURES;

EXHIBITIONS; FORECASTING; VAPORS;

THERMAL CONDUCTIVITY;

EID: 84860340250     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2011-52039     Document Type: Conference Paper

References (24)

1. Lu, M., Mok, L., and Bezama, R. J., 2006, "A Graphite Foams Based Vapor Chamber for Chip Heat Spreading," Journal of Electronic Packaging, 128, pp. 427.
2. Sauciuc, I., Chrysler, G., Mahajan, R., and Prasher, R., 2002, "Spreading in the Heat Sink Base: Phase Change Systems or Solid Metals?," IEEE Transactions on Components and Packaging Technologies, 25 (4), pp. 621-628.
3. Kalahasti, S., and Joshi, Y. K., 2002, "Performance Characterization of a Novel Flat Plate Micro Heat Pipe Spreader," IEEE Transactions on Components and Packaging Technologies, 25 (4), pp. 554-560.
4. Maydanik, Y. F., Vershinin, S. V., Korukov, M. A., and Ochterbeck, J. M., 2005, "Miniature Loop Heat Pipes - A Promising Means for Cooling Electronics," IEEE Transactions on Components and Packaging Technologies, 28 (2), pp. 290-296.
5. Legierski, J., and Wiecek, B., 2001, "Steady State Analysis of Cooling Electronic Circuits Using Heat Pipes," IEEE Transactions on Components and Packaging Technologies, 24 (4), pp. 549-553.
6. Ranjan, R., Murthy, J. Y., and Garimella, S. V., 2009, "Analysis of the Wicking and Thin-film Evaporation Characteristics of Wick Microstructures," ASME Journal of Heat Transfer, 131, pp. 101001 (1-11).
7. Ranjan, R., Murthy, J. Y., and Garimella, S. V., 2011, "A Microscale Model for Thin-film Evaporation in Capillary Wick Structures," International Journal of Heat and Mass Transfer, 54 (1-3), pp. 169-179.
8. Ranjan, R., Murthy, J. Y., Garimella, S. V., and Vadakkan, U., 2011, "A Numerical Model for Transport in Flat Heat Pipes Considering Wick Microstructure Effects," International Journal of Heat and Mass Transfer, 54 (1-3), pp. 153-168.
9. th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm), 2-5 June 2010, Las Vegas, NV.
10. Vadakkan, U., Garimella, S. V., and Murthy, J. Y., 2004, "Transport in Flat Heat Pipes at High Fluxes from Multiple Discrete Sources," ASME Journal of Heat Transfer, 126, pp. 347-354.
11. Vadakkan, U., Murthy, J. Y., and Garimella, S. V., 2003, "Transient Analysis of Flat Heat Pipes," Procs. ASME Summer Heat Transfer Conference, July 21-23, Las Vegas, Nevada.
12. Do, K. H., Kim, S. J., and Garimella, S. V., 2008, "A Mathematical Model for Analyzing the Thermal Characteristics of a Flat Micro Heat Pipe with a Grooved Wick," International Journal of Heat and Mass Transfer, 51 (19-20), pp. 4637-4650.
13. Carbajal, G., Sobhan, C. B., Peterson, G. P., Queheillalt, D. T., and Wadley, H. N. G., 2007, "A Quasi-3D Analysis of the Thermal Performance of a Flat Heat Pipe," International Journal of Heat and Mass Transfer, 50, pp. 4286-4296.
14. Koito, Y., Imura, H., Mochizuki, M., Saito, Y., and Torii, S., 2006, "Numerical Analysis and Experimental Verification on Thermal Fluid Phenomena in a Vapor Chamber," Applied Thermal Engineering, 26, pp. 1669-1676.
15. Prasher, R., 2003, "A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology," ASME Journal of Electronic Packaging, 125, pp. 378-385.
16. Weibel, J. A., Garimella, S. V., and North, M. T., 2010, "Characterization of Evaporation and Boiling from Sintered Powder Wicks fed by Capillary Action," International Journal of Heat and Mass Transfer, 53 (19-20), pp. 4204-4215.
17. Altman, D. H., Wasniewski, J. R., North, M. T., Kim, S. S., and Fisher, T. S., 2011, "Development of Micro/nano Engineered Wick-Based Passive Heat Spreaders for Thermal Management of High Power Electronic Devices," Proceedings of the ASME 2011 InterPACK, Portland, OR, July 6-8, 2011, InterPACK2011-521122.
18. th IHPC), Shanghai, China, September 21-25.
19. Schrage, R. W., 1953, "A Theoretical Study of Interface Mass Transfer," New York: Columbia University Press.
20. Carey, V. P., "Liquid-Vapor Phase Change Phenomena," Hemisphere Publishing Corp., Washington DC.
21. Rose, W., 1998, "Interphase Matter Transfer, the Condensation Coefficient and Dropwise Condensation," Proc. 11th Int. Heat Transfer Conf., Kyongju, Korea, 1, pp. 89-104.
22. Fluent Inc., Fluent 6.2 User's Guide, (2004).
23. Wang, H., Garimella, S. V., and Murthy, J. Y., 2007, " Characteristics of an Evaporating Thin Film in a Microchannel," International Journal of Heat and Mass Transfer, 50, pp. 3933-3942.
24. Vadakkan, U., Garimella, S. V., and Murthy, J. Y., 2003, "Prediction of Dryout in Flat Heat Pipes at High Heat Fluxes From Multiple Discrete Sources" ASME International Mechanical Engineering Congress and Exposition 2003, November 15-21, 2003, Washington, DC, USA, paper no. IMECE2003-42444, pp. 741-751.