A graphite foams based vapor chamber for chip heat spreading

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 427-431

  Lu, Minhua ^a   Mok, Larry ^a   Bezama, R J ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

Chip cooling; Graphite foam; Heat spreader; Vapor chamber

Indexed keywords

BOILING LIQUIDS; CAPILLARY FLOW; GRAPHITE; HEAT FLUX; HEAT RESISTANCE; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY; VAPORS; WETTING;

CHIP COOLING; CHIP HEAT SPREADING; GRAPHITE FOAMS; OXYGEN PLASMA; VAPOR CHAMBERS;

FOAMS;

EID: 33846689019     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2351908     Document Type: Article

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