Spreading in the heat sink base: Phase change systems or solid metals??

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 4, 2002, Pages 621-628

  Sauciuc, Ioan ^a   Chrysler, Greg ^a   Mahajan, Ravi ^a   Prasher, Ravi ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Boiling; Electronics cooling; Heat pipe; Heat sink; Phase change; Spreading resistance; Vapor chamber

Indexed keywords

BOILING LIQUIDS; COMPUTER SYSTEMS; COOLING SYSTEMS; COST EFFECTIVENESS; HEAT CONDUCTION; HEAT PIPES; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; MICROPROCESSOR CHIPS; PHASE CHANGING CIRCUITS; PROGRAM PROCESSORS; SILICON;

SOLID METALS;

MICROELECTRONICS;

EID: 0036999764     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.807994     Document Type: Conference Paper

References (5)

1. A. Faghri, Heat Pipe Science and Technology. Washington, DC: Taylor and Francis, 1995.
2. Incropera and D. P. De Witt, Fundamentals of Heat and Mass Transfer. New York: Wiley, 1990.
3. R. S. Prasher, J. C. Shipley, and A. Devpura, "A simplified modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology," in Proc. Int. Mech. Eng. Congr. Expo., New York, NY, 2001.
4. R. S. Prasher, "A simplified conduction based modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology," J. Electron. Packag., 2002, to be published.
5. J. P. Rohensaw, J. P. Hartent, and M. Ganic, Handbook of Heat Transfer, 2nd ed. New York: McGraw-Hill Book, 1985.