A simplified conduction based modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 378-385

  Prasher, Ravi S ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL GEOMETRY; COMPUTER SIMULATION; HEAT SINKS; HEAT TRANSFER; HEATING; SENSITIVITY ANALYSIS;

THERMAL DESIGNERS; THERMAL SOLUTION; THERMO-FLUIDIC MODELING; VAPOR CHAMBER TECHNOLOGY;

HEAT PIPES;

EID: 0141884173     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1602479     Document Type: Article

References (7)

1. Faghri, A., 1995, Heat Pipe Science and Technology, Taylor and Francis, Washington, DC.
2. Chesser, J. B., Peterson, G. P., and Lee, S., 2000, "A Simplified Method for Determining the Capillary Limitation of Flat Plate Heat Pipes in Electronic Cooling Applications," Proceedings of 34th National Heat Transfer Conference, Pittsburg, PA, August 20-22.
3. Dunn, P. D., and Reay, D. A., Heat Pipes, 4th edition, Pergamon, Elsevier Science Inc., New York.
4. Shepherd, D. G., 1965, Elements of Fluid Mechanics, Harcourt, Brace & World Inc., New York, pp. 246-248.
5. Taylor, B. N., and Kuyatt, C. E., 1994, "Guidelines for Evaluating and Expressing the Uncertainty of NIST Measurement Results," NIST Technical Note 1297, United States Department of Commerce, Washington, DC.
6. Prasher, R. S., Koning, P., Shipley, J. C., and Devpura, A., 2001, "Effect of Particle Volume Fraction on Thermal Conductivity and Mechanical Particle Volume Fraction," Proceedings of International Mechanical Eng. Congress and Expo., November 11-16, New York, NY, Vol. 1.
7. Prasher, R. S., Koning, P., Shipley, J. C., and Devpura, A., 2003, "Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction," ASME J. Electron. Packag. September, pp. 386-391.