Numerical analysis and experimental verification on thermal fluid phenomena in a vapor chamber

Applied Thermal Engineering

Volumn 26, Issue 14-15, 2006, Pages 1669-1676

  Koito, Yasushi ^a   Imura, Hideaki ^a   Mochizuki, Masataka ^b   Saito, Yuji ^b   Torii, Shuichi ^a  

^a KUMAMOTO UNIVERSITY   (Japan)

^b FUJIKURA LTD   (Japan)

Author keywords

Computer cooling; CPU; Heat pipe; Heat spreader; Heat transfer; Vapor chamber

Indexed keywords

COMPUTER WORKSTATIONS; COOLING SYSTEMS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS; PERSONAL COMPUTERS;

COMPUTER COOLING; CPU; HEAT SPREADER; VAPOR CHAMBER;

HEAT PIPES;

EID: 33646368132     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2005.11.012     Document Type: Article

References (10)

1. M. Mochizuki, Th. Nguyen, K. Mashiko, Y. Saito, Ti. Nguyen, V. Wuttijumnong, X. Wu, Practical application of heat pipe and vapor chamber for cooling high performance personal computer, in: Proceedings of the 13th International Heat Pipe Conference, 2004, pp. 448-454.
2. Y. Koito, K. Motomatsu, H. Imura, M. Mochizuki, Y. Saito, Fundamental investigations on heat transfer characteristics of heat sinks with a vapor chamber, in: Proceedings of the 7th International Heat Pipe Symposium, 2003, pp. 247-251.
3. M. Mochizuki, Th. Nguyen, K. Mashiko, Y. Saito, Ti. Nguyen, X. Wu, V. Wuttijumnong, Latest technology using micro heat pipes and vapor chamber for cooling personal computer, in: Proceedings of the 1st International Symposium on Micro & Nano Technology, 2004, XXXV-C-02 (CD-ROM).
4. Chen M., and Faghri A. An analysis of the vapor flow and the heat conduction through the liquid-wick and pipe wall in a heat pipe with single or multiple heat sources. Int. J. Heat Mass Transfer 33 9 (1990) 1945-1955
5. Faghri A., and Buchko M. Experimental and numerical analysis of low-temperature heat pipes with multiple heat sources. ASME J. Heat Transfer 113 3 (1991) 728-734
6. G. Gutierrez, Y. Jia, T. Jen, Analysis of the temperature evolution at the vapor-liquid interface during a transient operation of a heat pipe, in: Proceedings of the 13th International Heat Pipe Conference, 2004, pp. 111-119.
7. Vadakkan U., Garimella S.V., and Murthy J.Y. Transport in flat heat pipes at high heat fluxes from multiple discrete sources. ASME J. Heat Transfer 126 3 (2004) 347-354
8. S. Lee, S. Song, V. Au, K.P. Moran, Constriction/spreading resistance model for electronics packaging, in: Proceedings of the 4th ASME/JSME Thermal Engineering Conference, vol. 4, 1995, pp. 199-206.
9. Faghri A. Heat Pipe Science and Technology (1995), Taylor & Francis, Washington, DC
10. Japan Association for Heat Pipes (JAHP). Jitsuyou Heat Pipe. second ed. (2001), Nikkan Kogyo Shimbun, Ltd., Tokyo (in Japanese)