A microscale model for thin-film evaporation in capillary wick structures

International Journal of Heat and Mass Transfer

Volumn 54, Issue 1-3, 2011, Pages 169-179

  Ranjan, Ram ^a   Murthy, Jayathi Y ^a   Garimella, Suresh V ^a  

^a Purdue University   (United States)

Author keywords

Electronics cooling; Evaporation; Heat pipes; Meniscus; Thin film; Wick structure

Indexed keywords

CAPILLARY WICK; DIFFERENT GEOMETRY; ELECTRONICS COOLING; ENERGY EQUATION; EVAPORATION HEAT TRANSFER; FLUID VELOCITIES; HEAT AND MASS TRANSFER; HEAT TRANSFER ENHANCEMENT; LIQUID LEVEL; LIQUID-VAPOR INTERFACE; MENISCUS; MENISCUS SHAPE; MICRO WIRE; MICRO-SCALES; NON-ISOTHERMAL CONDITION; NUMERICAL MODELS; RECTANGULAR GROOVE; SATURATED VAPOR; SOLID-LIQUID; SOLID-VAPOR; STEADY EVAPORATION; SURFACE EVOLVER; THERMOCAPILLARY CONVECTION; WEBER NUMBERS; WICK STRUCTURES; WIRE MESHES; YOUNG LAPLACE EQUATION;

BLOOD VESSELS; CAPILLARY FLOW; CONTACT ANGLE; ELECTRONIC EQUIPMENT; EVAPORATION; GEOMETRY; HEAT CONVECTION; HEAT PIPES; LAPLACE EQUATION; LIQUIDS; MASS TRANSFER; SINTERING; VAPORS;

PHASE INTERFACES;

EID: 78449304028     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2010.09.037     Document Type: Article

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