Analysis of the wicking and thin-film evaporation characteristics of microstructures

Journal of Heat Transfer

Volumn 131, Issue 10, 2009, Pages 1-11

  Ranjan, Ram ^a   Murthy, Jayathi Y ^a   Garimella, Suresh V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE DISTANCE; BOND NUMBERS; CAPILLARY PRESSURES; CONDUCTION RESISTANCE; EFFECTIVE THERMAL RESISTANCE; FREE SURFACES; GEOMETRICAL PARAMETERS; HEAT TRANSFER PERFORMANCE; HEXAGONAL PACKING; LIQUID LEVEL; LIQUID VOLUME; NONDIMENSIONAL; PASSIVE COOLING; PERFORMANCE PARAMETERS; SOLID WALL; SOLID-LIQUID; SURFACE EVOLVER; THERMAL CONDUCTION; VERTICALLY ALIGNED; WICKING;

CAPILLARITY; CAPILLARY TUBES; CONTACT ANGLE; CYLINDERS (SHAPES); EVAPORATION; GEOMETRY; HEAT EXCHANGERS; HEAT RESISTANCE; HEAT TRANSFER; MICROSTRUCTURE; TOPOLOGY;

LIQUIDS;

EID: 77954541474     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.3160538     Document Type: Article

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