A numerical model for transport in heat pipes considering wick microstructure effects

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Ranjan, Ram ^a   Murthy, Jayathi Y ^a   Garimella V, Suresh ^a   Vadakkan, Unnikrishnan ^b  

^a PURDUE UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Electronics cooling; Evaporation; Heat spreader; Vapor chamber; Wick structure

Indexed keywords

COUPLED MODELS; DURING PHASE; ELECTRONICS COOLING; ENERGY EQUATION; EVAPORATION AND CONDENSATION; EVAPORATION MODEL; HEAT SPREADERS; INTERFACIAL AREAS; LEVEL MODEL; LIQUID-VAPOR INTERFACE; MACRO MODEL; MARANGONI CONVECTION; MASS FLUX; MENISCUS CURVATURE; MICROSTRUCTURE EFFECTS; NUMERICAL MODELS; POROUS MEDIUM; THREE-DIMENSIONAL FLOW; VAPOR CHAMBER; VAPOR FLOWS; WICK STRUCTURES;

CONDENSATION; ELECTRONICS ENGINEERING; EVAPORATION; HEAT PIPES; HEAT TRANSFER; HEATING EQUIPMENT; LIQUIDS; MICROSTRUCTURE; NAVIER STOKES EQUATIONS; PHASE INTERFACES; POROUS MATERIALS; SPREADERS; VAPORS;

THREE DIMENSIONAL;

EID: 77955204030     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501374     Document Type: Conference Paper

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