Development of micro/nano engineered wick-based passive heat spreaders for thermal management of high power electronic devices

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

Volumn 2, Issue , 2011, Pages 213-220

  Altman, David H ^a   Wasniewski, Joseph R ^a   North, Mark T ^b   Kim, Sungwon S ^c   Fisher, Timothy S ^c  

^a RAYTHEON COMPANY   (United States)

^b Aavid Thermacore Europe Ltd   (United States)

^c PURDUE UNIVERSITY   (United States)

Author keywords

Boiling; Carbon nanotube (CNT); Heat pipe; Heat spreader; Nanostructured wicks; Sintered powder wick; Thermal resistance; Vapor chamber

Indexed keywords

CRITICAL PARTS; CU POWDERS; DESIGN AND CONSTRUCTION; DEVICE PACKAGING; FUNCTIONALIZATIONS; HEAT SPREADERS; HEAT TRANSFER MECHANISM; HEAT TRANSPORT; HIGH HEAT FLUX; HIGH-POWER ELECTRONIC DEVICES; LOW PROFILE; LOW RESISTANCE; MULTI-CHIP; NANO-STRUCTURED; PACKAGING DESIGNS; RAYTHEON; SINTERED POWDERS; STATE-OF-THE-ART APPROACH; THERMAL PERFORMANCE; VAPOR CHAMBER; VERTICALLY ALIGNED CARBON NANOTUBE;

BOILING LIQUIDS; CARBON NANOTUBES; DESIGN; ELECTRIC POWER SYSTEMS; EVAPORATORS; EXHIBITIONS; HEAT FLUX; HEAT PIPES; HEAT RESISTANCE; HEAT TRANSFER; HEATING EQUIPMENT; MIXED CONVECTION; PACKAGING; PACKAGING MATERIALS; SINTERING;

VAPORS;

EID: 84860327036     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2011-52122     Document Type: Conference Paper

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