Steady state analysis of cooling electronic circuits using heat pipes

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 4, 2001, Pages 549-553

  Legierski, Jaroslaw ^a   Wiecek, Boguslaw ^a  

^a LODZ UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Heat pipe; Natural and forced convection cooling; Radiator

Indexed keywords

COMPUTER SIMULATION; COOLING; FORCED CONVECTION; HEAT LOSSES; HEAT PIPES; HEAT RESISTANCE; NATURAL CONVECTION; RADIATORS; VLSI CIRCUITS;

STEADY STATE ANALYSIS;

FINS (HEAT EXCHANGE);

EID: 0035691782     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.974941     Document Type: Article

References (5)

1. Heat pipe cooling fins for integrated circus
2. Simulation of heat distribution and thermal parameters determination in thin material samples