Microstructure and creep characteristics of Zn-3Cu-xAl ultra high-temperature lead-free solders

Materials and Design

Volumn 39, Issue , 2012, Pages 397-403

  Alibabaie, S ^a   Mahmudi, R ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

Author keywords

A. Non ferrous metals and alloys; E. Creep; F. Microstructure

Indexed keywords

ACTIVATION ENERGY; ALUMINUM; CREEP RESISTANCE; DIFFUSION; MECHANISMS; MICROSTRUCTURE; SOLDERING ALLOYS; ZINC;

AL CONTENT; CREEP ACTIVATION ENERGY; CREEP CHARACTERISTICS; CREEP MECHANISM; CREEP RATES; CREEP RESISTANT; DISLOCATION CLIMB; E. CREEP; F. MICROSTRUCTURE; HIGH TEMPERATURE; IMPRESSION CREEP; LAMELLAR EUTECTIC; LATTICE DIFFUSION; LEAD FREE SOLDERS; LOW TEMPERATURES; NONFERROUS METALS AND ALLOYS; PARALLEL MECHANISMS; PIPE DIFFUSION; RATE-CONTROLLING MECHANISM; SOLDER ALLOYS; SPHEROIDISATION; STRESS EXPONENTS;

CREEP;

EID: 84859947827     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2012.03.005     Document Type: Article

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