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Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 8, 2011, Pages 1168-1172

Shear strength of the Zn-Sn high-temperature lead-free solders

(2) Mahmudi, R a Eslami, M a

a UNIVERSITY OF TEHRAN (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

HARSH ENVIRONMENT; HIGH TEMPERATURE; LEAD FREE SOLDERS; MATRIX; SHEAR YIELD STRESS; SOLDER ALLOYS; STRENGTH BEHAVIOR; TEMPERATURE RANGE; TEST TEMPERATURES; ULTIMATE SHEAR STRENGTH;

SHEAR STRENGTH; SOLDERING ALLOYS; TIN ALLOYS; YIELD STRESS; ZINC;

TIN;

EID: 80051546045 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0279-4 Document Type: Article

Times cited : (41)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.