Characteristics of Zn-Al-Cu alloys for high temperature solder application

Materials Transactions

Volumn 49, Issue 7, 2008, Pages 1531-1536

  Kim, Seong Jun ^a   Kim, Keun Soo ^a   Kim, Sun Sik ^a   Kang, Chung Yun ^b   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Pusan National University   (South Korea)

Author keywords

High temperature; Lead free solder; Melting range; Microstructure; Spreadability; Tensile property; Zinc aluminum copper

Indexed keywords

BRAZING; COPPER; COPPER COMPOUNDS; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; MICROSTRUCTURE; SOLDERING ALLOYS; WELDING; ZINC; ZINC ALLOYS;

HIGH TEMPERATURE; LEAD-FREE SOLDER; MELTING RANGE; SPREADABILITY; TENSILE PROPERTY; ZINC-ALUMINUM-COPPER;

COPPER ALLOYS;

EID: 50549090505     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MF200809     Document Type: Article

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