Creep behavior of 90 Pb-10 Sn alloy

Physica Status Solidi (A) Applied Research

Volumn 198, Issue 2, 2003, Pages 387-394

  Balani, Kantesh ^a   Yang, Fuqian ^a  

^a UNIVERSITY OF KENTUCKY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; BINARY ALLOYS; COMPUTER SIMULATION; CREEP; MECHANICAL TESTING; PHASE INTERFACES; VELOCITY;

CREEP FLOW; IMPRESSION TESTING; INTERFACIAL SLIDING; PUNCHING STRESS;

LEAD ALLOYS;

EID: 0141494393     PISSN: 00318965     EISSN: None     Source Type: Journal    
DOI: 10.1002/pssa.200306626     Document Type: Article

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