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Volumn 159, Issue 2, 2012, Pages

Introduction of an electroless-plated ni diffusion barrier in Cu/Sn/Cu bonding structures for 3D integration

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BONDING LAYERS; BONDING STRUCTURE; BONDING TEMPERATURES; CU BUMPS; CU DIFFUSION; ELECTROLESS-PLATED NI;

EID: 84855324284     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.007202jes     Document Type: Article
Times cited : (15)

References (14)
  • 6
    • 0028494896 scopus 로고
    • 10.1016/0040-6090(94)90761-7
    • C. Y. Lee and K. L. Lin, Thin Solid Films, 249, 201 (1994). 10.1016/0040-6090(94)90761-7
    • (1994) Thin Solid Films , vol.249 , pp. 201
    • Lee, C.Y.1    Lin, K.L.2
  • 11
    • 0036613819 scopus 로고    scopus 로고
    • TEM observation of interfaces in a solder joint in a semiconductor device
    • DOI 10.1016/S1468-6996(02)00025-6, PII S1468699602000256
    • H. Matsuki, H. Ibuka and H. Saka, Sci. Technol. Adv. Mater., 3, 261 (2002). 10.1016/S1468-6996(02)00025-6 (Pubitemid 34946805)
    • (2002) Science and Technology of Advanced Materials , vol.3 , Issue.3 , pp. 261-270
    • Matsuki, H.1    Ibuka, H.2    Saka, H.3
  • 12
    • 0036642259 scopus 로고    scopus 로고
    • Reliability study of the electroless Ni-P layer against solder alloy
    • DOI 10.1016/S0026-2714(02)00068-9, PII S0026271402000689
    • M. O. Alam, Y. C. Chan, and K. C. Hung, Microelectron. Reliab., 42, 1065 (2002). 10.1016/S0026-2714(02)00068-9 (Pubitemid 34648971)
    • (2002) Microelectronics Reliability , vol.42 , Issue.7 , pp. 1065-1073
    • Alam, M.O.1    Chan, Y.C.2    Hung, K.C.3
  • 14
    • 28844456147 scopus 로고    scopus 로고
    • Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection
    • DOI 10.1557/JMR.2005.0246
    • Y. C. Sohn and J. Yu, J. Mater. Res., 20, 1931 (2005). 10.1557/JMR.2005.0246 (Pubitemid 41763296)
    • (2005) Journal of Materials Research , vol.20 , Issue.8 , pp. 1931-1934
    • Sohn, Y.-C.1    Yu, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.