New aspects in characterization of adhesion of moulding compounds on different surfaces by using a simple button-shear-test method for lifetime prediction of power devices

Microelectronics Reliability

Volumn 50, Issue 9-11, 2010, Pages 1684-1687

  Goroll, Michael ^a   Pufall, Reinhard ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION PROPERTIES; AUTOMOTIVE ELECTRONICS; BOND PAD; BOUNDARY SURFACES; CHIP SURFACES; COMPOUND MATERIAL; COPPER LEAD FRAMES; DEGRADATION EFFECT; FORCE-DISPLACEMENT DIAGRAMS; HIGH RELIABILITY; HIGH TEMPERATURE STORAGE; LIFETIME PREDICTION; POLYIMIDE LAYERS; POWER DEVICES; PROCESS PARAMETERS; QUALIFICATION STANDARDS; SEMICONDUCTOR PACKAGES; STRESS TEST; TEMPERATURE CYCLING; TEST METHOD; TEST TIME REDUCTION;

ADHESION; DEGRADATION; MOLDING; POLYIMIDES; SEMICONDUCTOR DEVICES; SILICON COMPOUNDS; SURFACES; TESTING;

LEAD COMPOUNDS;

EID: 84755161239     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.07.038     Document Type: Conference Paper

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